Specific Process Knowledge/Lithography/UVExposure/aligner MLA3: Difference between revisions
Created page with "==Aligner: Maskless 03== 400px|thumb|Aligner: Maskless 03 is located in E-5. MLA150 WMII maskless aligner from Heidelberg Instruments GmbH, installed 2020. '''Special features:''' *Backside Alignment *Advanced Field Alignment Mode for alignment to individual chips/devices on the substrate *Separate conversion PC (Power PC) Link to information about alignment mark design. '''[http..." |
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===Exposure dose and defocus=== | ===Exposure dose and defocus=== | ||
[[Specific Process Knowledge/Lithography/Resist#Aligner:_Maskless_03|Information on UV exposure dose]] | [[Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMasklessAligners#Aligner:_Maskless_03|Information on UV exposure dose]] | ||
===[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 03 processing|Process information]]=== | ===[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 03 processing|Process information]]=== | ||
