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Specific Process Knowledge/Lithography/Development: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,871 edits
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[[Image:IMG 2464.JPG|400px|right|thumb|Developer: TMAH Manual 02 is located in E-4.]]
[[Image:IMG 2464.JPG|400px|right|thumb|Developer: TMAH Manual 02 is located in E-4.]]


Developer: TMAH Manual 02 is a manually operated, single substrate or chip puddle developer. It uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in  water with a small amount of wetting agent). The substrates or chips are loaded manually one by one into the developer. Developer dispense, puddle time, water rinse, and drying is performed automatically by the equipment.
Developer: TMAH Manual 02 is a manually operated single wafer, or chip, puddle developer. It uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in  water with a small amount of wetting agent). The wafers or chips are loaded manually one by one into the developer. Developer dispense, puddle time, water rinse, and drying is performed automatically by the equipment.
 


'''[https://www.youtube.com/watch?v=btinNzYnLnY Training video]'''
'''[https://www.youtube.com/watch?v=btinNzYnLnY Training video]'''


The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager] - '''requires login'''
The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager] - '''requires login'''
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#Dispense puddle while rotating substrate slowly
#Dispense puddle while rotating substrate slowly
#Puddle development while not rotating
#Puddle development while not rotating
#Agitate substrate once per 15 seconds by rotating slowly for 1 second
#Agitate substrates with 15 cycles per minute
#Spin off developer
#Spin off developer
#Clean substrate and chamber with DI water
#Clean substrate and chamber with DI water
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'''Process recipes'''<br>
'''Process recipes'''<br>
SP: Single-puddle<br>
*-Rinse-
MP: Multi-puddle
*1x015s
 
*1x030s
*01 Rinse
*1x060s
*02 SP 15
*1x120s
*03 SP 30
*2x060s
*04 SP 60
*5x060s
*05 SP 90
*06 SP 120
*07 SP 300
*08 MP 2x60
*09 MP 5x60
*91 SP test
*92 MP test


=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===
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|style="background:LightGrey; color:black"|Handling
|style="background:LightGrey; color:black"|Handling
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Chip chuck for chips and 2" wafers
*Chip chuck for chips and 50 mm wafers
*Non-vacuum chuck for 100 mm and 150 mm wafers
*Non-vacuum chuck for 100 mm and 150 mm wafers
|-
|-
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|style="background:LightGrey; color:black"|Agitation
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
1 second rotational agitation at 30 rpm every 15 seconds
15 cycles per minute
|-
|-
|style="background:LightGrey; color:black"|Rinse
|style="background:LightGrey; color:black"|Rinse
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Development"