Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 01 processing: Difference between revisions
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In the MLA1-MLA1 alignment tests, the design consists of ±5µm verniers with 0.1µm resolution along the X and Y axis placed in a 3 by 3 matrix covering a 60mm by 60mm area centered on the wafer. The sample is loaded, and the first layer with linear scales is printed (without global angle). Without unloading, the second layer with vernier scales is printed on top of the first, and then the sample is developed. The deviations (±) given for the results here are calculated as half the range of measurements. If the range is small, the measurement uncertainty is used instead. | In the '''MLA1-MLA1 alignment tests''', the design consists of ±5µm verniers with 0.1µm resolution along the X and Y axis placed in a 3 by 3 matrix covering a 60mm by 60mm area centered on the wafer. The sample is loaded, and the first layer with linear scales is printed (without global angle). Without unloading, the second layer with vernier scales is printed on top of the first, and then the sample is developed. The deviations (±) given for the results here are calculated as half the range of measurements. If the range is small, the measurement uncertainty is used instead. | ||
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In the MLA3-MLA1 alignment tests, the design consists of ±5µm verniers with 0.25µm resolution along the X and Y axis placed in a 3 by 3 matrix covering a 60mm by 60mm area centered on the wafer. The first layer with linear scales was printed in MLA3 as QC test wafers a long time ago and subsequently patterned using lift-off of gold. These wafers are coated with resist, the second layer with vernier scales is printed in MLA1, and then the sample is developed. The deviations (±) given for the results here are calculated as half the range of measurements. If the range is small, the measurement uncertainty is used instead. | In the '''MLA3-MLA1 alignment tests''', the design consists of ±5µm verniers with 0.25µm resolution along the X and Y axis placed in a 3 by 3 matrix covering a 60mm by 60mm area centered on the wafer. The first layer with linear scales was printed in MLA3 as QC test wafers a long time ago and subsequently patterned using lift-off of gold. These wafers are coated with resist, the second layer with vernier scales is printed in MLA1, and then the sample is developed. The deviations (±) given for the results here are calculated as half the range of measurements. If the range is small, the measurement uncertainty is used instead. | ||
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