Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 01 processing: Difference between revisions

@@ Line 187: / Line 187: @@
 | 0.10
 | ±0.225
+|-
+|-style="background:WhiteSmoke; color:black"
+|rowspan="2"|Field alignment
+(after development,<br>global alignment to 2 marks on X-axis)
+|'''X'''
+|rowspan="2" align="center"|1: -37500; 0<br>2: 37500; 0
+|rowspan="2" align="center"|8.414
+| -
+|rowspan="2" align="center"| -
+| 0,04
+| ±0,05
+|-
+|-style="background:WhiteSmoke; color:black"
+|'''Y'''
+| -
+| -0,22
+| ±0,075
 |-
@@ Line 244: / Line 263: @@
 | -2,69
 | ±0,2
-|-
-|-style="background:WhiteSmoke; color:black"
-|rowspan="2"|Field alignment
-(after development,<br>global alignment to 2 marks on X-axis)
-|'''X'''
-|rowspan="2" align="center"|1: -37500; 0<br>2: 37500; 0
-|rowspan="2" align="center"|8.414
-| -
-|rowspan="2" align="center"| -
-| 0,04
-| ±0,05
-|-
-|-style="background:WhiteSmoke; color:black"
-|'''Y'''
-| -
-| -0,22
-| ±0,075
 |-
@@ Line 323: / Line 323: @@
 |}
+In the MLA3-MLA1 alignment tests, the design consists of ±5µm verniers with 0.25µm resolution along the X and Y axis placed in a 3 by 3 matrix covering a 60mm by 60mm area centered on the wafer. The first layer with linear scales was printed in MLA3 as QC test wafers a long time ago and subsequently patterned using lift-off of gold. These wafers are coated with resist, the second layer with vernier scales is printed in MLA1, and then the sample is developed.
 {|border="1" cellspacing="0" cellpadding="3" style="text-align:center;"