Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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# The Platen power has the setting ''120 >> 140 (1.5s) 45 '' - it is to be interpreted as: | # The Platen power has the setting ''120 >> 140 (1.5s) 45 '' - it is to be interpreted as: | ||
## In the first 1.5 seconds of the every cycle the platen power has a value that is ramped (indicated by >>) from 120 W initially to 150 W in the end | ## In the first 1.5 seconds of the every cycle the platen power has a value that is ramped (indicated by >>) from 120 W initially to 150 W in the end | ||
## During the | ## During the remainder of the cycle the platen power is kept constant at 45 W. | ||
# The | # The Pressure has the setting ''25 (1.5 s) 90 >> 150'' - it is to be interpreted as: | ||
## In the first 1.5 seconds the pressure is constant at 25 mtorr. | |||
## During the remainder of the cycle the pressure has i higher value that is ramped from 90 initially to 150 mtorr in the last etch cycle. | |||
=== Process A === | === Process A === | ||