Specific Process Knowledge/Lithography/Coaters/Spin Coater: RCD8 processing: Difference between revisions
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'''Dispensing from the syringe:'''<br> | '''Dispensing from the syringe:'''<br> | ||
Start by removing the end cap from the syringe. For the first dispense, remove any air in the tip of the syringe by dispensing the first drop somewhere outside the substrate. Start the dispense in the center of the wafer, keeping the tip of the syringe as close to the substrate as possible (so the dispensed resist forms a continuous puddle, rather than strings that bunch up and trap air). Make sure the dispensed resist puddle is in the center of the substrate, otherwise all of the resist may flow to one side during | Start by removing the end cap from the syringe. For the first dispense, remove any air in the tip of the syringe by dispensing the first drop somewhere outside the substrate. Start the dispense in the center of the wafer, keeping the tip of the syringe as close to the substrate as possible (so the dispensed resist forms a continuous puddle, rather than strings that bunch up and trap air). Make sure the dispensed resist puddle is in the center of the substrate, otherwise all of the resist may flow to one side during spinning, causing the other side of the substrate to not be covered, even though enough resist was dispensed. During the dispense, the position of the puddle can be controlled by moving the tip of the syringe while continuing the dispense. Towards the end of the dispense, move the tip to the edge of the puddle. Stop the dispense but keep the tip at the last spot to allow the last resist to finish flowing. Now, lift the tip a couple of cm up, then down again and up again, in order to break the thin string of resist that forms between the tip and the puddle. | ||
'''Bubbles in the resist film after coating:'''<br> | '''Bubbles in the resist film after coating:'''<br> | ||