Specific Process Knowledge/Lithography/Coaters/RCD8: Difference between revisions
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*Spin coating of PGMEA based AZ resists | *Spin coating of PGMEA based AZ resists | ||
*Spin coating of wafers with structured backside | *Spin coating of wafers with structured backside | ||
*Edge bead removal | *(Edge bead removal) | ||
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!style="background:silver; color:black;" align="center" width="60"|Resist | !style="background:silver; color:black;" align="center" width="60"|Resist | ||
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|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* manual dispense | * manual dispense | ||
* automatic dispense from syringe | * <strike>automatic dispense from syringe</strike> | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance | ||