Specific Process Knowledge/Characterization/Tencor P17: Difference between revisions
Appearance
| Line 18: | Line 18: | ||
*Vendor's description of [https://labmanager.dtu.dk/view_binary.php?fileId=6385 instrument specs including reproducibility and flatness of scans] (''requires login as it seems not freely available from vendor's website'') | *Vendor's description of [https://labmanager.dtu.dk/view_binary.php?fileId=6385 instrument specs including reproducibility and flatness of scans] (''requires login as it seems not freely available from vendor's website'') | ||
*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis|Apex software access & tips]] | *Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis|Apex software access & tips]] | ||
*Vendor's document on 2D stress measurements (also somewhat informative for 3D stress measurements) including info on the automatic fitting to calculate the local radius of the wafer: [https://www.kla.com/wp-content/uploads/KLA_AppNote_Stylus_2D_Stress.pdf]. | *Vendor's document on 2D stress measurements (also somewhat informative for 3D stress measurements) including info on the automatic fitting to calculate the local radius of the wafer: [https://www.kla.com/wp-content/uploads/KLA_AppNote_Stylus_2D_Stress.pdf]. | ||
*Tips on making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''. Most users will make 3D stress measurement as described in the regular Nanolab manual for the P17 in LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan - the software does not allow rotation of the stage for this type of scan. | |||
<br> | <br> | ||