Specific Process Knowledge/Characterization/Tencor P17: Difference between revisions

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 *Info about [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy |measurement accuracy]] (''measured with Dektak XTA'')
 *Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis|Apex software access & tips]]
-*Info about making [https://labmanager.dtu.dk/view_binary.php?fileId=4699 2D stress measurements] ''(requires login)''
+*Info about making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''
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+Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not allow rotation of the stage for this type of scan.
-Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not even allow manual rotation of the stage for this type of scan.
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