Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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= The DRIE Pegasus at Danchip = | |||
# Presentation | |||
# The Bosch process | |||
# The standard etches | |||
# Additional etches including nanoetch | |||
# Processing challenges such as bonded wafers | |||
# SPTS documents | |||
== Presentation == | |||
The DRIE Pegasus is a state-of-art silicon dry etcher. It offers outstanding performance in terms of etch rate, uniformity etc. This page will provide some clues. | |||
[[Image:DRIE-Pegasus.jpg |300x300px|thumb|The SPTS Pegasus in the Danchip cleanroom]] | [[Image:DRIE-Pegasus.jpg |300x300px|thumb|The SPTS Pegasus in the Danchip cleanroom]] | ||
==The Bosch process in the DRIE-Pegasus== | ==The Bosch process in the DRIE-Pegasus== | ||
[[Specific Process Knowledge/Etch/DRIE-Pegasus/multiplexing| | |||
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The DRIE-Pegasus takes the well established Bosch process known from the [[Specific_Process_Knowledge/Etch/ASE_(Advanced_Silicon_Etch)|ASE]] a significant step further. In the ASE the Bosch process has two cycles, etch and passivation. During each cycle the process parameters are kept constant (This is, at least, that is the intention - the reality is that the ideal square function is rarely achieved during process parameter changes). | The DRIE-Pegasus takes the well established Bosch process known from the [[Specific_Process_Knowledge/Etch/ASE_(Advanced_Silicon_Etch)|ASE]] a significant step further. In the ASE the Bosch process has two cycles, etch and passivation. During each cycle the process parameters are kept constant (This is, at least, that is the intention - the reality is that the ideal square function is rarely achieved during process parameter changes). | ||