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Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions

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It was tried (jan09) to lift 2.5 µm Al on 4.2µ negative resist on top of 11 µm Apox SiO2 in an acetone sonic-bath.
It was tried (jan09) to lift 2.5 µm Al on 4.2µ negative resist on top of 11 µm Apox SiO2 in an acetone sonic-bath.
The Al deposition process was done in steps evaporating 500 nm a time with 5 min pause and pressure down to at least 2E-6.
The Al deposition process was done in steps evaporating 500 nm a time with 5 min pause and pressure down to at least 2E-6.
==Roughness of thermally evaporated aluminium==
A study by AFM was performed to examine Al films deposited with thermal evaporation in the Wordentec. See details [[/Roughness of thermally evaporated aluminium|here]].
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