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Specific Process Knowledge/Characterization/Tencor P17: Difference between revisions

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== Process information ==
== Process information ==
*Info about [//Dektak_XTA Measurement Accuracy] (''measured with Dektak XTA'').
*Info about [//Dektak_XTA Measurement Accuracy] (''measured with Dektak XTA'')
 
*Using the analysis software: [[Specific_Process_Knowledge/Characterization/Profiler/Apex software|Apex software access & tips]]
*Using the analysis software: [[Specific_Process_Knowledge/Characterization/Profiler/Apex software|Apex software access & tips]]
 
*Info about making [https://labmanager.dtu.dk/view_binary.php?fileId=4699 2D stress measurements] ''(requires login)''
*Info about making [https://labmanager.dtu.dk/view_binary.php?fileId=4699 2D stress measurements] ''(requires login)''.
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Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not even allow manual rotation of the stage for this type of scan.
Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not even allow manual rotation of the stage for this type of scan.
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== Acceptance test ==
== Acceptance test ==
*The acceptance test carried out for the P17: [[:File:Acceptance test p17 final_no-names.pdf]]
*The acceptance test carried out for the P17: [[:File:Acceptance test p17 final_no-names.pdf]]