Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions
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==Types of stress and their origin == | ==Types of stress and their origin == | ||
A thin film can exhibit either compressive or tensile stress as illustrated by Figure 1:<br> | A thin film can exhibit either compressive or tensile stress as illustrated by Figure 1:<br> | ||
[[File:berit-film-stress-illustration-cropped.png|upright=3|alt=A rectangle illustrates a substrate without stress. A downward curving section of a sphere with a red band on top illustrates a substrate with compressive stress due to a thinfilm. An upward curving section of a sphere with a green band on top illustrates a substrate with tensile stress.|right|thumb|Figure 1: Compressive and tensile stress (figure by Berit Herstrøm).]] | [[File:berit-film-stress-illustration-cropped.png|upright=3|align="center"|alt=A rectangle illustrates a substrate without stress. A downward curving section of a sphere with a red band on top illustrates a substrate with compressive stress due to a thinfilm. An upward curving section of a sphere with a green band on top illustrates a substrate with tensile stress.|right|thumb|Figure 1: Compressive and tensile stress (figure by Berit Herstrøm).]] | ||
Examples of thin films that exhibit tensile stress include Cr, Pt, and Ni (evaporated or sputtered) as well as SiO2 made by LPCVD TEOS. SiN made by PECVD can exhibit either tensile or compressive stress. The same is true for sputtered Si. Thin films that exhibit compressive stress include e-beam evaporated Ti and Au. | Examples of thin films that exhibit tensile stress include Cr, Pt, and Ni (evaporated or sputtered) as well as SiO2 made by LPCVD TEOS. SiN made by PECVD can exhibit either tensile or compressive stress. The same is true for sputtered Si. Thin films that exhibit compressive stress include e-beam evaporated Ti and Au. | ||