Specific Process Knowledge/Process Flow: Difference between revisions
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'' | ''Drawings in this section done by Jesper Hanberg @DTU Nanolab'' | ||
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| width="150" align="center" style="color:black" | Surface Toppography [[image:dummy.png|130px|frameless|link=Specific Process Knowledge/Wafer cleaning|Analysis of form, shape, size, structure, and surface features including surface roughness.]] | |||
| width="150" align="center" style="color:black"| Chemical Composition and Molecular Interaction [[image:dummy.png|130px|frameless|link=Specific Process Knowledge/Wafer and sample drying|Identication of elemental composition and chemical states as well as molecular interactions.]] | |||
| width="150" align="center" style="color:black"| Mechanical Properties [[image:dummy.png|130px|frameless|link=Specific Process Knowledge/Thin film deposition|These techniques measure hardness, elasticity, and stress.]] | |||
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| width="150" align="center" style="color:black"| Optical Properties [[image:dummy.png|130px|frameless|link=Specific Process Knowledge/Doping]] | |||
| width="150" align="center" style="color:black"| Electrical Properties [[image:dummy.png|130px|frameless|link=Specific Process Knowledge/Thermal Process]] | |||
| width="150" align="center" style="color:black"| Thermal Properties [[image:dummy.png|130px|frameless|link=Specific Process Knowledge/Pattern Design]] | |||
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== Special Requirements == | == Special Requirements == | ||