Specific Process Knowledge/Back-end processing: Difference between revisions
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! '''Note! Packlab | ! '''Note! The SupportLab (former Packlab) has been established and tools are currently relocated.''' | ||
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Please note that the training on machines requires the "Introductino course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information. | |||
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Below you can see a list of equipment for back-end processing that is available at DTU Nanolab. | Below you can see a list of equipment for back-end processing that is available at DTU Nanolab. | ||
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* Chip/die mounting | * Chip/die mounting | ||
**[[/Die Bonder|Die Bonder (eutectic metal)]] | **[[/Die Bonder|Die Bonder (eutectic metal)]] | ||
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*Wire bonding | *Wire bonding | ||
**[[/Wire Bonder|TPT Wire Bonder]] | **[[/Wire Bonder|TPT Wire Bonder]] | ||
**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | **[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | ||
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*Wafer dicing/machining | *Wafer dicing/machining | ||
**[[/Polisher CMP|Polisher CMP - located in the cleanroom]] | **[[/Polisher CMP|Polisher CMP - located in the cleanroom]] | ||
**[[/Polishing machine|Polisher/Lapper machine]] | **[[/Polishing machine|Polisher/Lapper machine]] | ||
**[[/LatticeAxe|LatticeAxe]] | **[[/LatticeAxe|LatticeAxe]] | ||
**[[/FlipScribe|FlipScribe]] | **[[/FlipScribe|FlipScribe]] | ||
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**[[/Disco Saw|Wafer cleaner DCS 1441 (post dicing)]] | **[[/Disco Saw|Wafer cleaner DCS 1441 (post dicing)]] | ||
**[[/Laser Micromachining Tool|Laser Micromachining Tool]] | **[[/Laser Micromachining Tool|Laser Micromachining Tool]] | ||
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*Pick & place | |||
**[[/Micro transfer printer|Micro transfer printer]] | |||
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* X-ray inspection system | * X-ray inspection system | ||
**[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]] | **[[/Focal Spot X-ray system|X-ray Focal Spot inspection system]] | ||
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== Choose processing method == | == Choose processing method == | ||
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*[[/Polishing machine|Polisher/Lapper machine]] | *[[/Polishing machine|Polisher/Lapper machine]] | ||
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* | *Diamond Pen (Wafer Scriber) | ||
*[[/LatticeAxe|LatticeAxe]] | *[[/LatticeAxe|LatticeAxe]] | ||
*[[/FlipScribe|FlipScribe]] | *[[/FlipScribe|FlipScribe]] | ||
Revision as of 16:56, 17 June 2025
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Back-end processing
Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
| Note! The SupportLab (former Packlab) has been established and tools are currently relocated.
|
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Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.
Choose an equipment
- Chip/die mounting
- Wire bonding
- Wafer dicing/machining
- Pick & place
Choose processing method
| Lapping/polishing | Cutting/cleaving | Milling | Die bonding | Wire bonding |
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