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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
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{| border="1" cellspacing="2" cellpadding="2" colspan="3"
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Aligner: Maskless 01 (MLA1) - Dose and Defoc'''
|bgcolor="#98FB98" |'''Quality Control (QC) for Aligner: Maskless 01 (MLA1) - Alignment'''
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Alignment accuracy in 9 points across a 100mm wafer is measured, the average alignment error is reported.
Alignment accuracy in 9 points across a 100mm wafer is measured, the average alignment error is reported.
|-  
|-  
|Backside alignment
|Expose an overlay design after automatic alignment to 4 backside alignment marks and applying scaling and shearing. Rotate the wafer 180° and repeat.
Alignment accuracy in 9 points across a 100mm wafer is measured, half the average alignment error is reported.
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| align="center" valign="top"|
| align="center" valign="top"|
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!QC limits
!QC limits
!Aligner: Maskless 01 (MLA1)
!Aligner: Maskless 01 (MLA1)
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|Topside alignment error
|>1µm
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|-
|Topside alignment error
|Topside alignment error
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