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Specific Process Knowledge/Lithography/Development: Difference between revisions

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==Development Comparison Table==
==Development Comparison Table==


{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
{| class="wikitable"
 
|-
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
!
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Manual_beaker_development_in_fumehood|Manual beaker development]]</b>
! [[Specific_Process_Knowledge/Lithography/Development#Manual_beaker_development_in_fumehood|Manual beaker development]]
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]</b>
! [[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]</b>
! [[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual 02|Developer: TMAH Manual 02]]</b>
! [[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual 02|Developer: TMAH Manual 02]]
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]</b>
! [[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development/DUV_developer#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]</b>
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
 
|-
|-
!style="background:silver; color:black" align="center" width="60"|Purpose  
! scope=row style="text-align: left;" | Purpose  
|style="background:LightGrey; color:black"|
|
 
|style="background:WhiteSmoke; color:black"|
Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools
Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools


Requires individual risk assessment!
<span style="color:red">Requires individual risk assessment!</span>
 
|
|style="background:WhiteSmoke; color:black"|
Development of:
Development of:
*SU-8
*SU-8
|style="background:WhiteSmoke; color:black"|
|
Development of:
Development of:
*ZEP 520A
*ZEP 520A
*AR-P 6200.xx (CSAR)
*AR-P 6200.xx (CSAR)
|style="background:WhiteSmoke; color:black"|
|  
Development of:
Development of:
*AZ nLOF
*AZ nLOF
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*AZ 4562
*AZ 4562
*DUV resists
*DUV resists
|style="background:WhiteSmoke; color:black"|
|  
Development of:
Development of:
*AZ nLOF
*AZ nLOF
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*DUV resists
*DUV resists
Post-exposure baking
Post-exposure baking
|style="background:WhiteSmoke; color:black"|
|
Development of:
Development of:
*DUV resists
*DUV resists
Post-exposure baking
Post-exposure baking
|-
|-
!style="background:silver; color:black" align="center" width="60"|Developer  
! scope=row style="text-align: left;" | Developer
|style="background:LightGrey; color:black"|
| Process dependent
 
| mr-Dev 600 (PGMEA)
|style="background:WhiteSmoke; color:black"|
|  
Process dependent
 
|style="background:WhiteSmoke; color:black"|
mr-Dev 600 (PGMEA)
|style="background:WhiteSmoke; color:black"|
*ZED N-50
*ZED N-50
*AR-600-546
*AR 600-50
|style="background:WhiteSmoke; color:black"|
| AZ 726 MIF (2.38% TMAH in water)
AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
|style="background:WhiteSmoke; color:black"|
| AZ 726 MIF (2.38% TMAH in water)
AZ 726 MIF (2.38% TMAH in water)
|style="background:WhiteSmoke; color:black"|
AZ 726 MIF (2.38% TMAH in water)
 
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Method
! scope=row style="text-align: left;" | Method
|style="background:LightGrey; color:black"|Development
| Submersion
|style="background:WhiteSmoke; color:black"|
| Submersion
Submersion
| Puddle
|style="background:WhiteSmoke; color:black"|
| Puddle
Submersion
| Puddle
|style="background:WhiteSmoke; color:black"|
| Puddle
Spray/Puddle
|style="background:WhiteSmoke; color:black"|
Puddle
|style="background:WhiteSmoke; color:black"|
Puddle
|style="background:WhiteSmoke; color:black"|
Puddle
|-
|-
|style="background:LightGrey; color:black"|Handling
! scope=row style="text-align: left;" | Handling
|style="background:WhiteSmoke; color:black"|
|
Manual handling in beakers
Manual handling in beakers
*Chip bucket
*Chip bucket
*Single wafer carrier
*Single wafer carrier
*Carrier for up to 5 wafers
*Carrier for up to 5 wafers
|style="background:WhiteSmoke; color:black"|
|
*Chip bucket
*Single wafer carrier
*Single wafer carrier
*Chip bucket
*Carrier for up to 6 wafers
*100 mm carrier for up to 6 wafers
|
|style="background:WhiteSmoke; color:black"|
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
*Chip chuck for chips & 2" substrates
*Chip chuck for chips & 2" substrates
|style="background:WhiteSmoke; color:black"|
|
*Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
*Chip chuck for chips & 2" substrates
*Chip chuck for chips & 2" substrates
|style="background:WhiteSmoke; color:black"|
| Vacuum chuck
Vacuum chuck
| Vacuum chuck
|style="background:WhiteSmoke; color:black"|
Vacuum chuck
|-
|-
 
! scope=row style="text-align: left;" | Process temperature
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
| Room temperature
|style="background:LightGrey; color:black"|Temperature
| Room temperature
 
| Room temperature
|style="background:WhiteSmoke; color:black"|
| Room temperature
Room temperature
| Room temperature
|style="background:WhiteSmoke; color:black"|
| Room temperature
Room temperature
|style="background:WhiteSmoke; color:black"|
Room temperature
|style="background:WhiteSmoke; color:black"|
Room temperature
|style="background:WhiteSmoke; color:black"|
Room temperature
|style="background:WhiteSmoke; color:black"|
Room temperature
|-
|-
|style="background:LightGrey; color:black"|Agitation
! scope=row style="text-align: left;" | Process agitation
 
| No agitation allowed
|style="background:WhiteSmoke; color:black"|
| Magnetic stirrer
No agitation allowed
| Rotation
|style="background:WhiteSmoke; color:black"|
| Rotation
Magnetic stirrer
| Rotation
|style="background:WhiteSmoke; color:black"|
| Rotation
Rotation
|style="background:WhiteSmoke; color:black"|
Rotation
|style="background:WhiteSmoke; color:black"|
Rotation
|style="background:WhiteSmoke; color:black"|
Rotation
|-
|-
|style="background:LightGrey; color:black"|Rinse
! scope=row style="text-align: left;" | Process rinse
 
| Process dependent
|style="background:WhiteSmoke; color:black"|
| IPA
Process dependent
| IPA
|style="background:WhiteSmoke; color:black"|
| DI water
IPA
| DI water
|style="background:WhiteSmoke; color:black"|
| DI water
IPA
|style="background:WhiteSmoke; color:black"|
DI water
|style="background:WhiteSmoke; color:black"|
DI water
|style="background:WhiteSmoke; color:black"|
DI water
 
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Substrate size
|style="background:LightGrey; color:black"|Substrate size
|
 
|style="background:WhiteSmoke; color:black"|
* Chips
* Chips
* 50 mm wafers
* 50 mm wafers
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
 
|
|style="background:WhiteSmoke; color:black"|
* Chips
* Chips
* 50 mm wafers
* 50 mm wafers
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* 150 mm wafers
* 150 mm wafers
* 200 mm wafers
* 200 mm wafers
|style="background:WhiteSmoke; color:black"|
|
* Chips (5mm to 2")
* Chips (5mm to 2")
* 50 mm wafers
* 50 mm wafers
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* 150 mm wafers
* 150 mm wafers
* 200 mm wafers
* 200 mm wafers
|style="background:WhiteSmoke; color:black"|
|
* Chips (5mm to 2")
* Chips (5mm to 2")
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
|style="background:WhiteSmoke; color:black"|
|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
* 200 mm wafers (may require tool change)
|style="background:WhiteSmoke; color:black"|
|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
* 200 mm wafers (may require tool change)
|-
|-
|style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Allowed materials
 
| All cleanroom approved materials
|style="background:WhiteSmoke; color:black"|
|
All cleanroom approved materials
|style="background:WhiteSmoke; color:black"|
*Silicon and glass substrates
*Silicon and glass substrates
*Film or pattern of all but Type IV
*Film or pattern of all but Type IV
|style="background:WhiteSmoke; color:black"|
| All cleanroom approved materials
All cleanroom approved materials
|
|style="background:WhiteSmoke; color:black"|
*All cleanroom approved materials
*All cleanroom approved materials
*Film or pattern of all types
*Film or pattern of all types
|style="background:WhiteSmoke; color:black"|
|
*Silicon and glass substrates
*Silicon and glass substrates
*Film or pattern of all but Type IV
*Films, or patterned films, of any material except type IV (Pb, Te)
|style="background:WhiteSmoke; color:black"|
|
*Silicon, III-V, and glass substrates
*Silicon, III-V, and glass substrates
*Film or pattern of all but Type IV
*Films, or patterned films, of any material except type IV (Pb, Te)
|-
|-
|style="background:LightGrey; color:black"|Batch
! scope=row style="text-align: left;" | Batch size
|style="background:WhiteSmoke; color:black"|
| 1 - 5
1 - 5
| 1 - 6
|style="background:WhiteSmoke; color:black"|
| 1
1 - 6
| 1
|style="background:WhiteSmoke; color:black"|
| 1 - 25
1
| 1 - 25
|style="background:WhiteSmoke; color:black"|
1
|style="background:WhiteSmoke; color:black"|
1 - 25  
|style="background:WhiteSmoke; color:black"|
1 - 25
|-
|}
|}
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