Specific Process Knowledge/Lithography/Development: Difference between revisions
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==Development Comparison Table== | ==Development Comparison Table== | ||
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! | ! | ||
! [[Specific_Process_Knowledge/Lithography/Development#Manual_beaker_development_in_fumehood|Manual beaker development]] | |||
! [[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]] | |||
! [[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]] | |||
! [[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual 02|Developer: TMAH Manual 02]] | |||
! [[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]] | |||
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer#Developer:_TMAH_Stepper|Developer: TMAH Stepper]] | |||
|- | |- | ||
!style=" | ! scope=row style="text-align: left;" | Purpose | ||
| | |||
Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools | Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools | ||
Requires individual risk assessment! | <span style="color:red">Requires individual risk assessment!</span> | ||
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Development of: | Development of: | ||
*SU-8 | *SU-8 | ||
| | |||
Development of: | Development of: | ||
*ZEP 520A | *ZEP 520A | ||
*AR-P 6200.xx (CSAR) | *AR-P 6200.xx (CSAR) | ||
| | |||
Development of: | Development of: | ||
*AZ nLOF | *AZ nLOF | ||
| Line 43: | Line 39: | ||
*AZ 4562 | *AZ 4562 | ||
*DUV resists | *DUV resists | ||
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Development of: | Development of: | ||
*AZ nLOF | *AZ nLOF | ||
| Line 51: | Line 47: | ||
*DUV resists | *DUV resists | ||
Post-exposure baking | Post-exposure baking | ||
| | |||
Development of: | Development of: | ||
*DUV resists | *DUV resists | ||
Post-exposure baking | Post-exposure baking | ||
|- | |- | ||
!style=" | ! scope=row style="text-align: left;" | Developer | ||
| | | Process dependent | ||
| mr-Dev 600 (PGMEA) | |||
| | |||
Process dependent | |||
mr-Dev 600 (PGMEA) | |||
*ZED N-50 | *ZED N-50 | ||
*AR | *AR 600-50 | ||
| | | AZ 726 MIF (2.38% TMAH in water) | ||
AZ 726 MIF (2.38% TMAH in water) | | AZ 726 MIF (2.38% TMAH in water) | ||
| | | AZ 726 MIF (2.38% TMAH in water) | ||
AZ 726 MIF (2.38% TMAH in water) | |||
| | |||
AZ 726 MIF (2.38% TMAH in water) | |||
|- | |- | ||
!style=" | ! scope=row style="text-align: left;" | Method | ||
| | | Submersion | ||
| Submersion | |||
Submersion | | Puddle | ||
| | | Puddle | ||
Submersion | | Puddle | ||
| | | Puddle | ||
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Puddle | |||
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Puddle | |||
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Puddle | |||
|- | |- | ||
! scope=row style="text-align: left;" | Handling | |||
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Manual handling in beakers | Manual handling in beakers | ||
*Chip bucket | *Chip bucket | ||
*Single wafer carrier | *Single wafer carrier | ||
*Carrier for up to 5 wafers | *Carrier for up to 5 wafers | ||
| | | | ||
*Chip bucket | |||
*Single wafer carrier | *Single wafer carrier | ||
* | *Carrier for up to 6 wafers | ||
| | |||
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates | *Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates | ||
*Chip chuck for chips & 2" substrates | *Chip chuck for chips & 2" substrates | ||
| | |||
*Vacuum-free edge-grip | *Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates | ||
*Chip chuck for chips & 2" substrates | *Chip chuck for chips & 2" substrates | ||
| | | Vacuum chuck | ||
Vacuum chuck | | Vacuum chuck | ||
| | |||
Vacuum chuck | |||
|- | |- | ||
! scope=row style="text-align: left;" | Process temperature | |||
!style=" | | Room temperature | ||
| Room temperature | |||
| Room temperature | |||
| | | Room temperature | ||
Room temperature | | Room temperature | ||
| | | Room temperature | ||
Room temperature | |||
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Room temperature | |||
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Room temperature | |||
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Room temperature | |||
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Room temperature | |||
|- | |- | ||
! scope=row style="text-align: left;" | Process agitation | |||
| No agitation allowed | |||
| | | Magnetic stirrer | ||
No agitation allowed | | Rotation | ||
| | | Rotation | ||
Magnetic stirrer | | Rotation | ||
| | | Rotation | ||
Rotation | |||
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Rotation | |||
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Rotation | |||
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Rotation | |||
|- | |- | ||
! scope=row style="text-align: left;" | Process rinse | |||
| Process dependent | |||
| | | IPA | ||
Process dependent | | IPA | ||
| | | DI water | ||
IPA | | DI water | ||
| | | DI water | ||
IPA | |||
| | |||
DI water | |||
| | |||
DI water | |||
| | |||
DI water | |||
|- | |- | ||
!style=" | ! scope=row style="text-align: left;" | Substrate size | ||
| | |||
* Chips | * Chips | ||
* 50 mm wafers | * 50 mm wafers | ||
* 100 mm wafers | * 100 mm wafers | ||
* 150 mm wafers | * 150 mm wafers | ||
| | |||
* Chips | * Chips | ||
* 50 mm wafers | * 50 mm wafers | ||
| Line 175: | Line 125: | ||
* 150 mm wafers | * 150 mm wafers | ||
* 200 mm wafers | * 200 mm wafers | ||
| | |||
* Chips (5mm to 2") | * Chips (5mm to 2") | ||
* 50 mm wafers | * 50 mm wafers | ||
| Line 181: | Line 131: | ||
* 150 mm wafers | * 150 mm wafers | ||
* 200 mm wafers | * 200 mm wafers | ||
| | |||
* Chips (5mm to 2") | * Chips (5mm to 2") | ||
* 100 mm wafers | * 100 mm wafers | ||
* 150 mm wafers | * 150 mm wafers | ||
| | |||
* 100 mm wafers | * 100 mm wafers | ||
* 150 mm wafers | * 150 mm wafers | ||
* 200 mm wafers (may require tool change) | * 200 mm wafers (may require tool change) | ||
| | |||
* 100 mm wafers | * 100 mm wafers | ||
* 150 mm wafers | * 150 mm wafers | ||
* 200 mm wafers (may require tool change) | * 200 mm wafers (may require tool change) | ||
|- | |- | ||
! scope=row style="text-align: left;" | Allowed materials | |||
| All cleanroom approved materials | |||
| | | | ||
All cleanroom approved materials | |||
*Silicon and glass substrates | *Silicon and glass substrates | ||
*Film or pattern of all but Type IV | *Film or pattern of all but Type IV | ||
| | | All cleanroom approved materials | ||
All cleanroom approved materials | | | ||
*All cleanroom approved materials | *All cleanroom approved materials | ||
*Film or pattern of all types | *Film or pattern of all types | ||
| | |||
*Silicon and glass substrates | *Silicon and glass substrates | ||
* | *Films, or patterned films, of any material except type IV (Pb, Te) | ||
| | |||
*Silicon, III-V, and glass substrates | *Silicon, III-V, and glass substrates | ||
* | *Films, or patterned films, of any material except type IV (Pb, Te) | ||
|- | |- | ||
! scope=row style="text-align: left;" | Batch size | |||
| | | 1 - 5 | ||
1 - 5 | | 1 - 6 | ||
| | | 1 | ||
1 - 6 | | 1 | ||
| | | 1 - 25 | ||
1 | | 1 - 25 | ||
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1 | |||
| | |||
1 - 25 | |||
| | |||
1 - 25 | |||
|} | |} | ||
<br clear="all" /> | <br clear="all" /> | ||