Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 04 processing: Difference between revisions
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<br/>The result of testing the flat alignment on a couple of wafers has shown the alignment to be within ±0.1° (1.7mRad). This matches the results observed on Aligner: Maskless 01. | <br/>The result of testing the flat alignment on a couple of wafers has shown the alignment to be within ±0.1° (1.7mRad). This matches the results observed on Aligner: Maskless 01. | ||
Repeatedly loading the same wafer, without moving it on the stage, gave values within 0.01mRad for both pneumatic and optical autofocus. A single outlier out of 13 measurements gave an error of 1.6mRad, corresponding to 0.1°. The measured angle, however, differed between pneumatic and optical. Investigating further, measuring the angles using different starting points (i.e., moving the wafer on the stage between tests), showed that the angle measured using optical autofocus was consistently higher than using pneumatic, by 3±1.6mRad, corresponding to 0.2±0.1°. | |||
=Alignment= | =Alignment= | ||