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Specific Process Knowledge/Lithography/Development: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
Line 87: Line 87:
*100 mm carrier for up to 6 wafers
*100 mm carrier for up to 6 wafers
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Vacuum-free edge-grip chucks for 50 mm, 100 mm, 150 mm, and 200 mm substrates
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
*Chip chuck for chips & 2" substrates
*Chip chuck for chips & 2" substrates
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
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