Specific Process Knowledge/Lithography/Descum: Difference between revisions
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==Multi wafer descum ashing rate and uniformity== | ==Multi wafer descum ashing rate and uniformity for plasma asher 4 & 5== | ||
[[File:PA_descum_multi_v3.png|400px|thumb|Ashing amount and ashing rate when processing multiple 100 mm wafers. Test measured on the center of 3 wafers.|right]] | [[File:PA_descum_multi_v3.png|400px|thumb|Ashing amount and ashing rate when processing multiple 100 mm wafers. Test measured on the center of 3 wafers.|right]] | ||