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Specific Process Knowledge/Lithography/Descum: Difference between revisions

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==Multi wafer ashing rate and uniformity==
==Multi wafer ashing rate and uniformity==
[[File:PA_descum_multi_v3.png|400px|thumb|Ashing amount and ashing rate when processing multiple 100 mm wafers. Test measured on the center of 3 wafers.|right]]
[[File:PA_descum_multi_v3.png|400px|thumb|Ashing amount and ashing rate when processing multiple 100 mm wafers. Test measured on the center of 3 wafers.|right]]
'''Multi wafer ashing rate'''<br>
 
{| class="wikitable"
{| class="wikitable" style="caption-side: top; text-align: center;"
|-
|-
! Ashing time [min]: !! 1 !! 2 !! 5 !! 10 !! 15
! style="text-align: left;" | Ashing time [min]: !! 1 !! 2 !! 5 !! 10 !! 15
|-
|-
| Ashing amount [nm]: || 4.3 || 6.7 || 10.1 || 39.5 || 78.8
| style="text-align: left;" | Ashing amount [nm]: || 4.3 || 6.7 || 10.1 || 39.5 || 78.8
|-
|-
| Ashing rate [nm/min]: || 4.3 || 3.4 || 2.0 || 4.0 || 5.3
| style="text-align: left;" | Ashing rate [nm/min]: || 4.3 || 3.4 || 2.0 || 4.0 || 5.3
|}
|}


'''Multi wafer non-uniformity'''<br>
{| class="wikitable"  style="caption-side: top; text-align: center;"
{| class="wikitable"
|-
|-
! Ashing time [min]: !! 1 !! 2 !! 5 !! 10 !! 15
! style="text-align: left;" | Ashing time [min]: !! 1 !! 2 !! 5 !! 10 !! 15
|-
|-
| Film thickness range, before descum [nm]: || 11 || 13 || 11 || 12 || 14
| style="text-align: left;" | Film thickness range, before descum [nm]: || 11 || 13 || 11 || 12 || 14
|-
|-
| Pre-ashing non-uniformity [%]: || 0.37 || 0.43 || 0.37 || 0.40 || 0.46
| style="text-align: left;" | Pre-ashing non-uniformity [%]: || 0.37 || 0.43 || 0.37 || 0.40 || 0.46
|-
|-
| Film thickness range, after descum [nm]: || 11 || 9 || 10 || 12 || 21
| style="text-align: left;" | Film thickness range, after descum [nm]: || 11 || 9 || 10 || 12 || 21
|-
|-
| Post-ashing non-uniformity [%]: || 0.37 || 0.30 || 0.33 || 0.41 || 0.74
| style="text-align: left;" | Post-ashing non-uniformity [%]: || 0.37 || 0.30 || 0.33 || 0.41 || 0.74
|}
|}