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Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium/End point: Difference between revisions

Bghe (talk | contribs)
Bghe (talk | contribs)
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The End point signal shows a top point after 5.0 s and I stopped the etch after 60 s.
The End point signal shows a top point after 5.0 s and I stopped the etch after 60 s.


<gallery caption="S047676 60s barc etch, Feb-2025, wafer center, 100 nm Cr mask, with 500 nm resist" widths="600px" heights="550px" perrow="2">
<gallery caption="S047670 60s barc etch, Feb-2025, wafer center, 100 nm Cr mask, with 500 nm resist" widths="600px" heights="550px" perrow="2">


File:20250213_02_endpoint.jpg
File:20250213_02_endpoint.jpg
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The End point signal shows a drop after 264 s and I stopped the etch after 7:45 min
The End point signal shows a drop after 264 s and I stopped the etch after 7:45 min


<gallery caption="S047676 7:45 min Cr etch, Feb-2025, wafer center, 100 nm Cr mask, with 500 nm resist" widths="600px" heights="550px" perrow="2">
<gallery caption="S047670 7:45 min Cr etch, Feb-2025, wafer center, 100 nm Cr mask, with 500 nm resist" widths="600px" heights="550px" perrow="2">


File:20250213_04_droppoint.jpg
File:20250213_04_droppoint.jpg