Specific Process Knowledge/Etch/ICP Metal Etcher/Chromium/End point: Difference between revisions
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==Etched too short== | ==Etched too short== | ||
The etch rate is faster near the edge. Therefor the trenches are in general wider at the edges. Here all structures has almost been etched down to the SiO2 layer and the dimensions are close to being unaffected. | The etch rate is faster near the edge. Therefor the trenches are in general wider at the edges. Here all structures has almost been etched down to the SiO2 layer and the dimensions are close to being unaffected. But especially the smallest trenches seems to be not all etched down to the SiO2. Also they are not equally wide. The sidewalls are close to being 90 degrees but some of them seems to have a little foot. To improve more the etch time should be longer - probably especially on the barc etch but maybe also for the Cr etch. | ||
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