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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,527 edits
Line 810: Line 810:
|style="background:LightGrey; color:black"|Exposure mode
|style="background:LightGrey; color:black"|Exposure mode
|style="background:WhiteSmoke; color:black" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
Projection or direct writing
*Projection
*Direct laser writing
|-
|-
| style="background:LightGrey; color:black"|Exposure light
| style="background:LightGrey; color:black"|Exposure light
|style="background:WhiteSmoke; color:black" colspan="2"|
|style="background:WhiteSmoke; color:black" colspan="2"|
365nm (LED) or 405nm (diode laser)
*365nm (LED) for projection
*405nm (diode laser) for direct laser writing
|-
|-
|style="background:LightGrey; color:black"|Focusing method
|style="background:LightGrey; color:black"|Focusing method
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