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Specific Process Knowledge/Lithography/Development: Difference between revisions

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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,871 edits
Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,871 edits
Line 657: Line 657:
|style="background:LightGrey; color:black"|Agitation
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
1 per 30 seconds:<br>
1 second rotational agitation at 30 rpm every 15 seconds
Slow rotation of substrate for 1 second
|-
|-
|style="background:LightGrey; color:black"|Rinse
|style="background:LightGrey; color:black"|Rinse
Line 667: Line 666:
|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Chips (6-60 mm)
*Chips (6-60 mm)
* 100 mm wafers
*100 mm wafers
* 150 mm wafers
*150 mm wafers
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|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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