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| {{CC1}} | | {{CC1}} |
| ==Overview of characteristics and where to measure it== | | ==Overview of characteristics and where to measure it== |
| {| {{table } }
| |
| | width="50" align="center" style="background:#f0f0f0;"|
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| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Optical_microscope| Optical Micro- scopes]]'''
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| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|SEM (incl. EDX)]]'''
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| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/AFM: Atomic Force Microscopy|AFM]]'''
| |
| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/Profiler|Stylus profiler]]'''
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| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Profiler#Optical_Profiler_(Sensofar_S_Neox)|Optical profiler]]'''
| |
| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Optical_characterization#Filmtek_4000|Filmtek (reflec- tometer)]]'''
| |
| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|Ellip- someter]]'''
| |
| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Thickness stylus]]'''
| |
| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/XPS|XPS]]'''
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| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/PL_mapper|PL mapper]]'''
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| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/4-Point_Probe|4-point probe]]'''
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| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Probe_station|Probe station]]'''
| |
| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/XRD|XRD]]'''
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| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Lifetime_scanner_MDPmap|Life time scanner]]'''
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| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Drop_Shape_Analyzer|Drop shape analyser]]'''
| |
| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific_Process_Knowledge/Characterization/Hardness_measurement|Hardness tester]]'''
| |
| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/Particle Scanner Takano|Particle scanner]]'''
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| | width="50" align="center" style="background:#f0f0f0;"|'''IR-camera'''
| |
| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/III-V_ECV-profiler|III-V ECV-profiler]]'''
| |
| | width="50" align="center" style="background:#f0f0f0;"|'''[[Specific Process Knowledge/Characterization/MicroSpectroPhotometer (Craic 20/30 PV)|Microspectrophotometer (Craic 20/30 PV)]]'''
| |
| |-
| |
| |-style="background:#DCDCDC;" align="center"
| |
| |align="left"| Breakdown voltage
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| |||||||||||||||||||||||||||||||||||||||
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| |-
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| |-style="background:#C0C0C0;" align="center"
| |
| |align="left"| Carrier density/doping profile
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| |||||||||||||||||||||||||||||||||||||x||
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|
| |
| |-
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| |-style="background:#DCDCDC;" align="center"
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| |align="left"| Charge carrier life time||||||||||||||||||||||||||||x||||||||||||
| |
| |-
| |
| |-style="background:#C0C0C0;" align="center"
| |
| |align="left"| Contact angle hydrophobic/hydrophillic||||||||||||||||||||||||||||||x||||||||||
| |
| |-
| |
| |-style="background:#DCDCDC;" align="center"
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| |align="left"| Crystallinity||||||||||||||||||||||||||x||||||||||||||
| |
| |-
| |
| |-style="background:#C0C0C0;" align="center"
| |
| |align="left"| Deposition uniformity||||||||||x||x||x||||||||||||||||||||||||||
| |
| |-
| |
| |-style="background:#DCDCDC;" align="center"
| |
| |align="left"|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Dimensions(in plane)]]||x||x||(x)||(x)||x||||||||||||||||||||||||||||||x
| |
| |-
| |
| |-style="background:#C0C0C0;" align="center"
| |
| |align="left"|[[Specific_Process_Knowledge/Characterization/Topographic_measurement|Dimensions(height)/Topography]]||(x)||(x)||x||x||x||||||||||||||||||||||||||||||
| |
| |-
| |
| |-style="background:#DCDCDC;" align="center"
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| |align="left"| Electrical conductivity||||||||||||||||||||||||x||||||||||||||||
| |
| |-
| |
| |-style="background:#C0C0C0;" align="center"
| |
| |align="left"| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x 4)||||||x 4)||||||||||||||
| |
| |-
| |
| |-style="background:#DCDCDC;" align="center"
| |
| |align="left"| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x 7)||||||||||||||
| |
| |-
| |
| |-style="background:#C0C0C0;" align="center"
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| |align="left"|[[Specific_Process_Knowledge/Characterization/Sample_imaging|Imaging]]||x||x||x||||x||||||||||||||||||||||||||||||x
| |
| |-
| |
| |-style="background:#DCDCDC;" align="center"
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| |align="left"| [[Specific_Process_Knowledge/Characterization/Hardness_measurement|Material Hardness]]||||||||||||||||||||||||||||||||x||||||||
| |
| |-
| |
| |-style="background:#C0C0C0;" align="center"
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| |align="left"| Band gap||||||||||||||x||||x||x||||||||||||||||||||
| |
| |-
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| |-style="background:#DCDCDC;" align="center"
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| |align="left"| Particles||x||x||x||||||||||||||||||||||||||||x||||||x
| |
| |-
| |
| |-style="background:#C0C0C0;" align="center"
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| |align="left"| Phase changes||||||||||||||||||||||||||||||||||||||||
| |
| |-
| |
| |-style="background:#DCDCDC;" align="center"
| |
| |align="left"| Reflectivity||||||||||||x||x||||||x 6)||||||||||||||||||||x
| |
| |-
| |
| |-style="background:#C0C0C0;" align="center"
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| |align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Refractive index]]||||||||||||x||x||||||||||||||||||||||||||
| |
| |-
| |
| |-style="background:#DCDCDC;" align="center"
| |
| |align="left"| Resistivity||||||||||||||||||||||x||||||||||||||||||
| |
| |-
| |
| |-style="background:#C0C0C0;" align="center"
| |
| |align="left"| Step coverage||x 1)||x 1)||||||||||||||||||||||||||||||||||||
| |
| |-
| |
| |-style="background:#DCDCDC;" align="center"
| |
| |align="left"| Surface roughness||||||x||x||x||||||||||||||||x||||||||||||||
| |
| |-
| |
| |-style="background:#C0C0C0;" align="center"
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| |align="left"| Thermal conductivity||||||||||||||||||||||||||||||||||||||||
| |
| |-
| |
| |-style="background:#DCDCDC;" align="center"
| |
| |align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x 1)||x 1)||x 2)||x 2)||x ||x||x||||||x 5)||x 3)||||x||||||||||||||
| |
| |-
| |
| |-style="background:#C0C0C0;" align="center"
| |
| |align="left"| Voids in wafer bonding||x||||||||||||||||||x||||||||||||||||x||||
| |
| |-
| |
| |-style="background:#DCDCDC;" align="center"
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| |align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x 1)||x 1)||||||||||||x||||||||||||||||||||||||
| |
| |-
| |
| |-style="background:#C0C0C0;" align="center"
| |
| |align="left"| Work function||||||||||||||||||x||||||||||||||||||||||
| |
| |-
| |
| |}
| |
|
| |
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| {| {{table } } | | {| {{table } } |
