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Specific Process Knowledge/Characterization/XRD: Difference between revisions

Eves (talk | contribs)
Eves (talk | contribs)
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Scanning mode
Scanning mode
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incident / receiver coupled or independent
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incident / receiver coupled or independent
incident / receiver coupled or independent
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Goniomenter radius
Goniomenter radius
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300 mm
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300 mm
300 mm
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Minimum step size
Minimum step size
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0.0001° (0.36")
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0.0001° (0.36")
0.0001° (0.36")
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Sample stage motion
Sample stage motion
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*χ:-5~+95°
*φ:0~360°
*Z:-4~+1 mm
*X,Y:±50 mm for a 100 mm wafer
*Rx,Ry:-5~+5°
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*χ:-5~+95°
*χ:-5~+95°
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*Cross Beam Optics(CBO)
*Cross Beam Optics(CBO)
*Ge(220)x2 monochromator
*Ge(220)x2 monochromator
*In-Plane Parallel Slit Collimator (PSC)
*Soller slit
*Automatic variable divergence slit
*Length limiting slits
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*Cross Beam Optics(CBO)
*Ge(400)x2 monochromator
*In-Plane Parallel Slit Collimator (PSC)
*In-Plane Parallel Slit Collimator (PSC)
*Soller slit
*Soller slit
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*Parallel slit analysers (PSA)
*Parallel slit analysers (PSA)
*Ge(220)x2 analyser
*Ge(220)x2 analyser
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*Automatic variable scattering slit
*Automatic variable receiver slit
*Parallel slit analysers (PSA)
*Ge(400)x2 analyser
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*0.04° soller slit
*0.04° soller slit
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Measurement temperature
|style="background:LightGrey; color:black"|Measurement temperature
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Room temperature
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Room temperature
Room temperature
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|style="background:LightGrey; color:black"|Substrate size
|style="background:LightGrey; color:black"|Substrate size
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up to 150 mm wafers
Thickness max 21 mm
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up to 150 mm wafers
up to 150 mm wafers
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No powders or dusty materials.
No powders or dusty materials.
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All materials have to be approved
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All materials have to be approved
All materials have to be approved