Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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==Poor metal adhesion/ Metal delaminating after lift-off== | ==Poor metal adhesion/ Metal delaminating after lift-off== | ||
''This experiment was done by Gustav E. Skands(ges@sbtinstruments.com)'' | ''This experiment was done by Gustav E. Skands(ges@sbtinstruments.com) in May 2024'' | ||
This entry details an observed issue with metal adhesion during a Ti/Pt deposition (10/160 nm) and lift-off process within DTU Nanolab. The employed photoresist was TI Spray from MicroChemicals, which is believed (but not confirmed) to share many properties with AZ5214E. The thickness of the resist was approximately 5 µm, and it was spray coated onto the substrate using the Spray Coater. | This entry details an observed issue with metal adhesion during a Ti/Pt deposition (10/160 nm) and lift-off process within DTU Nanolab. The employed photoresist was TI Spray from MicroChemicals, which is believed (but not confirmed) to share many properties with AZ5214E. The thickness of the resist was approximately 5 µm, and it was spray coated onto the substrate using the Spray Coater. | ||