Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions
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!style="background:silver; color:black;" align="left"|Purpose | !style="background:silver; color:black;" align="left"|Purpose | ||
|style="background:LightGrey; color:black"|Deposition of | |style="background:LightGrey; color:black"|Deposition of various materials ||style="background:WhiteSmoke; color:black"| | ||
*Sputtering of magnetic metals and | *Sputtering of metals including alloys and magnetic metals, semiconductors including silicon, and some dielectrica. See tables above and ask staff if there is a material you would like to deposit which you do not see listed. | ||
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!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance | !style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance | ||