Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch/nano10: Difference between revisions
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! rowspan="3" align="center"| Conditions | ! rowspan="3" align="center"| Conditions | ||
| Run ID | | Run ID | ||
| | | 1801 | ||
|- | |- | ||
| Conditioning | | Conditioning | ||
Revision as of 09:31, 28 March 2011
The nano1.0 recipe
| Recipe | Gas | C4F8 38 sccm, SF6 52 sccm |
|---|---|---|
| Pressure | 4 mTorr, Strike 3 secs @ 15 mTorr | |
| Power | 800 W CP, 50 W PP | |
| Temperature | 10 degs | |
| Hardware | 100 mm Spacers | |
| Time | 120 secs | |
| Conditions | Run ID | 1801 |
| Conditioning | Sequence: Oxygen clean, MU tests, processes, no oxygen between runs | |
| Mask | 1dfhj10 nm zep etched down to 6dgh4 nm |
- The results of the nano1.0 recipe
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The 30 nm trenches
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The 60 nm trenches
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The 90 nm trenches
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The 120 nm trenches
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The 150 nm trenches