Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
| Line 387: | Line 387: | ||
|- | |- | ||
|style="background:LightGrey; color:black" align="center" |Electron source | |style="background:LightGrey; color:black" align="center" |Electron source | ||
|style="background:Whitesmoke; color:black" colspan=" | |style="background:Whitesmoke; color:black" colspan="3" align="center"| FEG (Field Emission Gun) source | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* Thermionic tungsten filament | * Thermionic tungsten filament | ||
| Line 430: | Line 430: | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* Up to 8" wafer with 6" view | * Up to 8" wafer with 6" view | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* Up to 6" wafer with full view | * Up to 6" wafer with full view | ||