Specific Process Knowledge/Lithography/Development: Difference between revisions

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 !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
-|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer:_SU8|Developer: SU8]]</b>
+|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer:_SU8|Developer: SU8 (wetbench)]]</b>
 |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam|Developer: E-beam]]</b>
 |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]</b>
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 |style="background:LightGrey; color:black"|Handling
 |style="background:WhiteSmoke; color:black"|
-Single wafer carrier
+*Single wafer carrier
+*Chip bucket
+*100 mm carrier for up to 6 wafers
 |style="background:WhiteSmoke; color:black"|
 *Vacuum chuck for 100 mm & 150 mm substrates
@@ Line 141: / Line 143: @@
 |style="background:WhiteSmoke; color:black"|
-*100 mm wafers
+* Chips
+* 50 mm wafers
+* 100 mm wafers
+* 150 mm wafers
+* 200 mm wafers
 |style="background:WhiteSmoke; color:black"|
 * Chips (5mm to 2")