Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing: Difference between revisions

Revision as of 09:38, 6 September 2023 view source Taran (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891 3,526 edits m →High Aspect Ratio (DOF) mode ← Older edit		Revision as of 09:40, 6 September 2023 view source Taran (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891 3,526 edits m →Back Side Alignment Newer edit →
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	'''Camera field of view (W x H):''' 640 µm x 480 µm		'''Camera field of view (W x H):''' 640 µm x 480 µm

	[[Image:MLA150_BSA_Backside.JPG\|center\|300px\|thumb\|Image of a BSA alignment mark during alignment. The mark is 300 µm wide. The blue cross-hair is ~18 µm. ]]		[[Image:MLA150_BSA_Backside.JPG\|center\|300px\|thumb\|Image of a BSA alignment mark during alignment. The mark is 300 µm wide. The blue cross-hair is ~18 µm. Screenshot by Thomas Anhøj @ DTU Nanolab, 2019.]]