Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/Nitride Etch: Difference between revisions
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[[Category: Etch (Dry) Equipment|DRIE]] | [[Category: Etch (Dry) Equipment|DRIE]] | ||
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==Etching of silicon rich nitride (SRN) with recipes developed for SiO2 etching== | ==Etching of silicon rich nitride (SRN) with recipes developed for SiO2 etching== | ||
Revision as of 11:00, 22 August 2023
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Etching of silicon rich nitride (SRN) with recipes developed for SiO2 etching
| Parameter | Recipe name: Slow Etch | Recipe name: Slow Etch2 |
|---|---|---|
| Coil Power [W] | 350 | 200 |
| Platen Power [W] | 25 | 50 |
| Platen temperature [oC] | 20 | 20 |
| H2 flow [sccm] | 15 | 15 |
| CF4 flow [sccm] | 30 | 30 |
| Pressure [mTorr] | 3 | 10 |
| Typical results | Slow Etch | Slow Etch2 |
|---|---|---|
| Etch of SRN | ~43nm/min [measured 39-50 nm/min over a 6" wafer] | 23-25 nm/min [4" on carrier]] |
| Etch rate of Si3N4 | ~49 nm/min [4" on carrier] | 24-26 nm/min [4" on carrier] |
| Etch rate of SiO2 | ~42nm/min [41-43 nm/min over a 6" wafer] | 13.7-14.7 nm/min [4" on carrier] |
| Etch rate in Si | ñm/min | 11-13 nm/min (10% load, 4" wafer on 6" carrier) |
| Etch rate of Mir resist | ~nm/min | ~17 nm/min |
| Tested etch time without burning the resist | 3 min (6 min => resist burned) | 30 min |
| Profile [o] |