Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4: Difference between revisions
No edit summary |
|||
| Line 10: | Line 10: | ||
[[Image:Peg3and4 front 2.JPG |frame|left|x300px|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]] | [[Image:Peg3and4 front 2.JPG |frame|left|x300px|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]] | ||
'''The user manual and contact information can be found in LabManager:''' | |||
<!-- give the link to the equipment info page in LabManager: --> | |||
[http://labmanager.nanolab.dtu.dk/function.php?module=Machine&view=view&mach=456 DRIE Pegasus 4 in LabManager - requires login] | |||
== Process information == | == Process information == | ||
Revision as of 08:32, 22 August 2023
Feedback to this page:
click here
Unless otherwise stated, this page is written by DTU Nanolab internal
Pegasus 4 - 150mm silicon oxide and silicon nitride etching
The user manual and contact information can be found in LabManager:
DRIE Pegasus 4 in LabManager - requires login
Process information
Standard recipes
Hardware changes
A few hardware modifications have been made on the Pegasus 3/4 since it was installed in 2019. The changes are listed below.
Wafer bonding
To find information on how to bond wafers or chips to a carrier wafer, click here.