Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
| Line 102: | Line 102: | ||
: https://doi.org/10.1116/6.0000196 | : https://doi.org/10.1116/6.0000196 | ||
<span id="anchor_name">some text</span> | |||
; Vy Thi Hoang Nguyen et al.: The CORE Sequence: A Nanoscale Fluorocarbon-Free Silicon Plasma Etch Process Based on SF6/O2 Cycles with Excellent 3D Profile Control at Room Temperature | ; Vy Thi Hoang Nguyen et al.: The CORE Sequence: A Nanoscale Fluorocarbon-Free Silicon Plasma Etch Process Based on SF6/O2 Cycles with Excellent 3D Profile Control at Room Temperature | ||
: 2020 ECS J. Solid State Sci. Technol. 9 024002 | : 2020 ECS J. Solid State Sci. Technol. 9 024002 | ||