Jump to content

Specific Process Knowledge/Lithography/4562: Difference between revisions

← Older edit
VisualWikitext
Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,716 edits
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,472 edits
No edit summary
 
Line 22: Line 22:




The thickest achievable coating using a normal spin cycle is 10 µm. However, reducing the spin-off time to a few seconds at 2000 rpm, has successfully been used to increase the coating thickness beyond 20 µm on a Gamma coater. The substrate waits for 1 min before softbake, in order to reduce the edge bead height.  
The thickest achievable coating using a normal spin cycle is 10 µm. However, reducing the spin-off time to a few seconds at 2000 rpm, has successfully been used to increase the coating thickness beyond 20 µm on a Gamma coater. The substrate waits for 1 min before softbake, in order to reduce the edge bead height. For these thicker coatings, the softbake time must be increased.


<br clear="all" />
<br clear="all" />
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/4562"