Specific Process Knowledge/Etch/RIE (Reactive Ion Etch): Difference between revisions
No edit summary |
mNo edit summary |
||
| Line 1: | Line 1: | ||
{{cc-nanolab}} | |||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''<br> | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''<br> | ||
[[Category: Equipment |Etch RIE]] | [[Category: Equipment |Etch RIE]] | ||
[[Category: Etch (Dry) Equipment |RIE]] | [[Category: Etch (Dry) Equipment |RIE]] | ||
=<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> = | =<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned </span> = | ||
<span style="color:#FF0000"> This information is save because it might be valuable as inspiration for other dry etch systems. | |||
== Etching using the dry etch technique RIE (Reactive Ion Etch) == | == Etching using the dry etch technique RIE (Reactive Ion Etch) == | ||
<!-- | <!-- | ||