Specific Process Knowledge/Lithography/UVExposure: Difference between revisions
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
Alignment and UV exposure | Alignment and UV exposure | ||
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|style="background:LightGrey; color:black"|Exposure mode | |style="background:LightGrey; color:black"|Exposure mode | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
Projection | Projection | ||
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| style="background:LightGrey; color:black"|Exposure light | | style="background:LightGrey; color:black"|Exposure light | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
405nm (laser diode array) | 405nm<br>(laser diode array) | ||
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|style="background:LightGrey; color:black"|Focusing method | |style="background:LightGrey; color:black"|Focusing method | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
Pneumatic | Pneumatic | ||
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|style="background:LightGrey; color:black"|Minimum structure size | |style="background:LightGrey; color:black"|Minimum structure size | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
down to | down to 1 µm | ||
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|style="background:LightGrey; color:black"|Design formats | |style="background:LightGrey; color:black"|Design formats | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
*'''GDS-II''' | *'''GDS-II''' | ||
*CIF | *CIF | ||
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|style="background:LightGrey; color:black"|Alignment modes | |style="background:LightGrey; color:black"|Alignment modes | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
*Top side alignment | *Top side alignment | ||
*Backside alignment | *Backside alignment | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
* maximum writing area: 150x150 mm<sup>2</sup> | * maximum writing area: 150x150 mm<sup>2</sup> | ||
* 150 mm wafer | * 150 mm wafer | ||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
All cleanroom materials | All cleanroom materials | ||
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|style="background:LightGrey; color:black"|Batch | |style="background:LightGrey; color:black"|Batch | ||
|style="background:WhiteSmoke; color:black | |style="background:WhiteSmoke; color:black" colspan="2"| | ||
1 | 1 | ||
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