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Specific Process Knowledge/Lithography/EBeamLithography/FirstEBL: Difference between revisions

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Thope (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
2,179 edits
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#Substrate preparation
#Substrate preparation
#-Resist coating
##Resist coating
# Numbered list item
##Discharge layer application
#  
#Pattern preparation
* Numbered list item
##Proximity Effect Correction
Resist coating and baking
##Export to JEOL52 V3.0 (V30) format
#Application of discharge layer
#Job preparation
#Pattern preparation, possibly including Proximity Effect Correction  
##Jobdeck file (JDF) and schedule file (SDF) preparation
#Jobdeck file (JDF) and schedule file (SDF) preparation
##Job file compilation
#Job file compilation
##Job verification
#Job file verification
#Exposure session
#Sample mounting
##Sample mounting
#Cassette transfer
##Cassette transfer
#System calibration
##System calibration
#Exposure
##Exposure
#Cassette and sample unloading
##Cassette and sample unloading
#Discharge layer removal
#Development
#Development
##Discharge layer removal
##Development


In the following we will look at each step in more detail and show step by step how to make a wafer/chip exposure.
In the following we will look at each step in more detail and show step by step how to make a wafer/chip exposure.
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