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The general workflow of E-beam lithography on the JEOL 9500 system is summarized below and explained in detail in the subsequent sections. In order to optimize usage of the system steps 1 to 6 must all be done ahead of the booked session on the 9500 system.  
The general workflow of E-beam lithography on the JEOL 9500 system is summarized below and explained in detail in the subsequent sections. In order to optimize usage of the system steps 1 to 6 must all be done ahead of the booked session on the 9500 system.  


#Resist coating and baking
#Substrate preparation
#Application of discharge layer on substrates with >100 nm non-conducting films
#-Resist coating
# Numbered list item
#
* Numbered list item
Resist coating and baking
#Application of discharge layer
#Pattern preparation, possibly including Proximity Effect Correction  
#Pattern preparation, possibly including Proximity Effect Correction  
#Jobdeck file (JDF) and schedule file (SDF) preparation
#Jobdeck file (JDF) and schedule file (SDF) preparation
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