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Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,915 edits
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''Sequence names and process parameters (Sequence no. 3000-3999):''
''Sequence names and process parameters (Sequence no. 3000-3999):''
*'''(3001) DCH 100mm PEB60s@110C+SP60s'''
 
'''(3001) DCH 100mm PEB60s@110C+SP60s'''<br>
A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 100mm SP 60s' development.
A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 100mm SP 60s' development.
*'''(3005) DCH 100mm PEB60s@110C+SP30s'''
 
 
'''(3005) DCH 100mm PEB60s@110C+SP30s'''<br>
A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 100mm SP 30s' development.
A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 100mm SP 30s' development.
*'''(3010) DCH 150mm PEB60s@110C+SP60s'''
 
 
'''(3010) DCH 150mm PEB60s@110C+SP60s'''<br>
A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 150mm SP 60s' development.
A combination of the 'DCH PEB 110C 60s' post-exposure bake and the 'DCH 150mm SP 60s' development.
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