Specific Process Knowledge/Lithography/Baking: Difference between revisions
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In order to avoid thermal curing of SU-8 residues on the hotplates, they are temperature limited to 180°C. | In order to avoid thermal curing of SU-8 residues on the hotplates, they are temperature limited to 180°C. | ||
The user manual, and contact information can be found in LabManager: | |||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] - '''requires login''' | |||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)] - '''requires login''' | |||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=453 Hotplate 3 (SU8)] - '''requires login''' | |||
<br clear="all" /> | <br clear="all" /> | ||