Jump to content

Specific Process Knowledge/Thermal Process/Furnace Noble: Difference between revisions

From LabAdviser
Paphol (talk | contribs)
No edit summary
Mmat (talk | contribs)
mNo edit summary
 
Line 1: Line 1:
{{cc-nanolab}}
'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Furnace_Noble click here]'''
'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Furnace_Noble click here]'''
''This page is written by DTU Nanolab  internal''


[[Category: Equipment |Thermal Noble]]
[[Category: Equipment |Thermal Noble]]
Line 7: Line 7:
[[Category: Furnaces|Noble]]
[[Category: Furnaces|Noble]]


===<span style="color:Red">EXPIRED!!! The Noble furnace has been removed from the cleanroom January 2020.</span>===
'''<p style="color:red;"> The Noble furnace has been decomissioned in January 2020.</span>'''





Latest revision as of 13:37, 4 June 2025

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here

The Noble furnace has been decomissioned in January 2020.

Noble furnace

The Noble Furnace is used for annealing and oxidation of different samples. Annealing can be done in a nitrogen or argon atmosphere. A bubbler has also been installed in the furnace, so it is possible to do both wet and dry oxidations. The maximum temperature of the furnace is 1000 oC.

In the Noble Furnaces more dirty samples with metals and some specific polymers are allowed. Different sample holder are available for wafers and smaller samples (placed on a Si carrier wafer).

The furnace is located in service area Cx1.

Please check the cross contamination information in LabManager before you use the furnace.

Noble furnace. Positioned in service area Cx1/ Photo: DTU Nanolab internal

The user manual, technical information and contact information can be found in LabManager:

Noble furnace

Overview of the performance of the Noble Furnace

Purpose
  • Oxidation
  • Annealing

Oxidation:

  • Dry
  • Wet (with bubbler. Water steam + N2)

Annealing:

  • N2
  • Ar
Process parameter range Process Temperature
  • Up to 1000 oC
Process pressure
  • 1 atm
Gasses on the system
  • N2: 0-5 SLM
  • O2: 0-5 SLM
  • Ar: 0-7 SLM
Substrates Batch size
  • 1-25 100 mm wafers (or 50 mm wafers) per run
  • A number of smaller samples (placed on a Si carrier wafer)
Substrate material allowed
  • Silicon samples
  • Silicon samples with metals
  • Silicon sample with polymers (only approved materials)