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Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions

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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,871 edits
Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,871 edits
Line 796: Line 796:
!Date
!Date
!Thickness
!Thickness
!Laser
!Autofocus
!Exposure mode
!Exposure mode
!Dose
!Dose
Line 808: Line 810:
| 2020-10-01<br>jehem
| 2020-10-01<br>jehem
|rowspan="2"| 1.5 µm
|rowspan="2"| 1.5 µm
| 405 nm
| Pneumatic
| Fast
| Fast
| 70 mJ/cm<sup>2</sup>
| 70 mJ/cm<sup>2</sup>
Line 813: Line 817:
| 2 µm (due to stitching)
| 2 µm (due to stitching)
| Dev: SP60s
| Dev: SP60s
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
| 2021-03-23<br>jehem
| 2021-03-23<br>jehem
| 405 nm
| Pneumatic
| Quality
| Quality
| 65 mJ/cm<sup>2</sup>
| 65 mJ/cm<sup>2</sup>
Line 823: Line 830:


|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:silver; color:black"
!rowspan="2"| AZ MiR 701<br><span style="color:red">Old PFOA containing version</span>
!rowspan="2"| AZ MiR 701<br><span style="color:red">Old PFOA containing version</span>
| 2020-02-01<br>jehem
| 2020-02-01<br>jehem
|rowspan="2"| 1.5 µm
|rowspan="2"| 1.5 µm
| 405 nm
| Pneumatic
| Fast
| Fast
| 300 mJ/cm<sup>2</sup>
| 300 mJ/cm<sup>2</sup>
Line 832: Line 841:
| 2 µm (due to stitching)<br>Non optimized dehydration reduction
| 2 µm (due to stitching)<br>Non optimized dehydration reduction
| PEB: 60s@110°C, Dev: SP60s
| PEB: 60s@110°C, Dev: SP60s
|-style="background:WhiteSmoke; color:black"
 
|-style="background:silver; color:black"
| 2021-08-25<br>jehem
| 2021-08-25<br>jehem
| 405 nm
| Pneumatic
| Quality
| Quality
| 175 mJ/cm<sup>2</sup>
| 175 mJ/cm<sup>2</sup>
Line 846: Line 858:
| 2020-10-01<br>jehem
| 2020-10-01<br>jehem
|rowspan="2"| 2.2 µm
|rowspan="2"| 2.2 µm
| 405 nm
| Pneumatic
| Fast
| Fast
| 43 mJ/cm<sup>2</sup>
| 43 mJ/cm<sup>2</sup>
Line 851: Line 865:
| >2 µm (a lot of stitching)
| >2 µm (a lot of stitching)
| Reversal bake: 120s@110°C, Flood exposure: 200mJ/cm<sup>2</sup>, Dev: SP60s
| Reversal bake: 120s@110°C, Flood exposure: 200mJ/cm<sup>2</sup>, Dev: SP60s
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
| 2021-08-25<br>jehem
| 2021-08-25<br>jehem
| 405 nm
| Pneumatic
| Quality
| Quality
| 32 mJ/cm<sup>2</sup>
| 32 mJ/cm<sup>2</sup>
Line 858: Line 875:
| 1 µm
| 1 µm
| Reversal bake: 120s@110°C, Flood exposure: 200mJ/cm<sup>2</sup>, Dev: SP60s
| Reversal bake: 120s@110°C, Flood exposure: 200mJ/cm<sup>2</sup>, Dev: SP60s
|-
|}
'''AZ nLOF 2020''' has also been tested. It seems to work even at 405nm, but the dose is so high (>10000) that exposure would be slower than Aligner: Maskless 02.
<br>
<br>
{|border="1" cellspacing="1" cellpadding="7" style="text-align:left;"
|-
|-


|-
|-
|-style="background:silver; color:black"
|-style="background:silver; color:black"
|
!AZ nLOF 2020
!Date
| 2023-01-13<br>jehem
!Thickness
| 2.0 µm
!Laser
| 405
!Autofocus
| Pneumatic
!Exposure mode
| Quality
!Dose
| 9000 mJ/cm<sup>2</sup>
!Defoc
| 0
!Resolution
| 1 µm
!Comments
| PEB: 60s @ 100°C,<br>Dev: SP60s<br> '''Due to the high dose required on this tool, it is recommended to process nLOF on tools with a more appropriate exposure light source'''
|-style="background:WhiteSmoke; color:black"
|-
|-


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