Specific Process Knowledge/Lithography/Development: Difference between revisions
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
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Development of | Development of: | ||
*AZ nLOF | *AZ nLOF | ||
*AZ MiR 701 | *AZ MiR 701 | ||
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!style="background:silver; color:black;" align="center" width="60"|Developer | !style="background:silver; color:black;" align="center" width="60"|Developer | ||
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AZ 726 MIF | AZ 726 MIF | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Method | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Method | ||
|style="background:LightGrey; color:black"|Development | |style="background:LightGrey; color:black"|Development | ||
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Spray/Puddle | Spray/Puddle | ||
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|style="background:LightGrey; color:black"|Handling | |style="background:LightGrey; color:black"|Handling | ||
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Edge handling chuck | *Edge handling chuck for 100 mm and 150 mm wafers | ||
*Vacuum chuck for 100 mm and 150 mm wafers | |||
*Chip chuck for chips and 2" wafers | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters | ||
|style="background:LightGrey; color:black"|Temperature | |style="background:LightGrey; color:black"|Temperature | ||
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Room temperature | Room temperature | ||
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|style="background:LightGrey; color:black"|Agitation | |style="background:LightGrey; color:black"|Agitation | ||
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none | none | ||
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|style="background:LightGrey; color:black"|Rinse | |style="background:LightGrey; color:black"|Rinse | ||
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DI water | DI water | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
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* Chips (6-60 mm) | * Chips (6-60 mm) | ||
* 100 mm wafers | * 100 mm wafers | ||
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| style="background:LightGrey; color:black"|Allowed materials | | style="background:LightGrey; color:black"|Allowed materials | ||
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All cleanroom approved materials | *All cleanroom approved materials | ||
*Film, or pattern, of all materials except Type IV | |||
Film or pattern of all | |||
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|style="background:LightGrey; color:black"|Batch | |style="background:LightGrey; color:black"|Batch | ||
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1 | 1 | ||
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