Specific Process Knowledge/Lithography/LiftOff: Difference between revisions

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 The image to the left shows a schematic of the lift off process.
-*'''1.''' The substrate is coated with the masking material.
+#The substrate is coated with the masking material.
-*'''2'''. The masking material is patterned. The mask must be a negative image of the desired material pattern.
+#The masking material is patterned. The mask must be a negative image of the desired material pattern.
-*'''3'''. The material is deposited on top of both mask and substrate. The mask sidewall slope should be negative in order to prevent the material covering the sidewalls during deposition.
+#The material is deposited on top of both mask and substrate. The mask sidewall slope should be negative in order to prevent the material covering the sidewalls during deposition.
-*'''4'''. The masking material is dissolved, thus lifting part of the deposited material.
+#The masking material is dissolved, thus lifting part of the deposited material.
-*'''5'''. The remaining material forms the desired pattern on the substrate.
+#The remaining material forms the desired pattern on the substrate.