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Specific Process Knowledge/Lithography/LiftOff: Difference between revisions

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!style="background:silver; color:black;" align="center"|Bath chemical  
!style="background:silver; color:black;" align="center"|Bath chemical  
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NMP (Remover 1165) / Rinse in IPA
NMP (Remover 1165) / Rinse in IPA
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User defined
User defined
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Process temperature
|style="background:LightGrey; color:black"|Process temperature
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Heating of the bath is possible.
*Heating of the bath is possible.
 
*The heating has been limited to 60°C
The heating has been limited to 60°C
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Heating is possible using portable hotplate or portable ultrasonic bath
Heating is possible using portable hotplate or portable ultrasonic bath
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|style="background:LightGrey; color:black"|Ultrasonic agitation
|style="background:LightGrey; color:black"|Ultrasonic agitation
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Continuous or pulsed
*Continuous or pulsed
 
*The power may be varied
The power may be varied
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Ultrasonic agitation is possible using portable ultrasonic bath
Ultrasonic agitation is possible using portable ultrasonic bath
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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Silicon or glass wafers
*Silicon or glass wafers
 
*Film or patterning of all except Type IV (Pb, Te)
Film or patterning of all but Type IV (Pb, Te)
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Any cleanroom material
Any cleanroom material
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