Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions
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== LESKER Sputter Tool== | == LESKER Sputter Tool== | ||
The purpose of the | The purpose of the [[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System (Lesker)]] is to deposit magnetic metals and dielectrica on a single 4" or 6" wafer at a time. | ||
It can be a problem to take wafers from the sputter system and into the other machines in the cleanroom since the sputter system is not very clean. In principle sputtering should therefore be the last step before you take your wafers out of the cleanroom. If you need to process your wafers further please contact the Thin Film group so they can help you. | It can be a problem to take wafers from the sputter system and into the other machines in the cleanroom since the sputter system is not very clean. In principle sputtering should therefore be the last step before you take your wafers out of the cleanroom. If you need to process your wafers further please contact the Thin Film group so they can help you. | ||