Specific Process Knowledge/Lithography/Baking: Difference between revisions
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|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
![[Specific_Process_Knowledge/Lithography/ | ![[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray coater hotplate]] | ||
![[Specific_Process_Knowledge/Lithography/Baking#Hotplate_1_.28SU8.29.2C_Hotplate_2_.28SU8.29.2C_Hoplate_3.28SU8.29_and_Hotplate_4.28SU8.29|SU8 hotplates 1, 2 and 3]] | ![[Specific_Process_Knowledge/Lithography/Baking#Hotplate_1_.28SU8.29.2C_Hotplate_2_.28SU8.29.2C_Hoplate_3.28SU8.29_and_Hotplate_4.28SU8.29|SU8 hotplates 1, 2 and 3]] | ||
![[Specific Process Knowledge/Lithography/Baking#Small_benchtop_hotplates|Small benchtop hotplates]] | ![[Specific Process Knowledge/Lithography/Baking#Small_benchtop_hotplates|Small benchtop hotplates]] | ||
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!Purpose | !Purpose | ||
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Adjustable temperature, contact bake | |||
*Soft bake | *Soft bake | ||
*PEB | *PEB | ||
*Hard bake | |||
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Programmable, ramped contact bake | Programmable, ramped contact bake | ||
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!Temperature | !Temperature | ||
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Maximum | Maximum 180°C | ||
Temperature with top-plate: Actual surface temperature = 0.9 * display value | |||
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Maximum 110°C | Maximum 110°C | ||
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!Substrate size | !Substrate size | ||
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* Pieces | |||
* 50 mm wafer | * 50 mm wafer | ||
* 100 mm wafer | * 100 mm wafer | ||
* 150 mm wafer | * 150 mm wafer | ||
* 200 mm wafer | |||
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* pieces | * pieces | ||
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!QC | !QC | ||
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https://labmanager.dtu.dk/view_binary.php?type=data&mach= | https://labmanager.dtu.dk/view_binary.php?type=data&mach=293 | ||
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